substrate基板
![ic substrate pcb(ic载板)](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=744749401,903756791&fm=253&fmt=auto&app=138&f=JPEG?w=300&h=300)
ic substrate pcb(ic载板)
图片尺寸300x300![薄膜技术(thinfilmceramicsubstrate,tfc)是指采用蒸镀,光刻与刻蚀等](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=2375036114,4154557545&fm=253&fmt=auto&app=138&f=JPEG?w=640&h=480)
薄膜技术(thinfilmceramicsubstrate,tfc)是指采用蒸镀,光刻与刻蚀等
图片尺寸640x480![ceramic substrate](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=3401792504,1590018744&fm=253&fmt=auto&app=138&f=JPEG?w=600&h=400)
ceramic substrate
图片尺寸600x400![free sample electronic circuit board 94v0 double](https://i.ecywang.com/upload/1/img1.baidu.com/it/u=3190632191,754736716&fm=253&fmt=auto&app=138&f=JPEG?w=500&h=500)
free sample electronic circuit board 94v0 double
图片尺寸750x750![基板切割加工](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=3075296837,2229640895&fm=253&fmt=auto&app=138&f=JPEG?w=500&h=500)
基板切割加工
图片尺寸500x500![process),其中包括玻璃基板(glass substrate),透明电极(transparent](https://i.ecywang.com/upload/1/img1.baidu.com/it/u=3898583862,3759184705&fm=253&fmt=auto&app=138&f=JPEG?w=640&h=480)
process),其中包括玻璃基板(glass substrate),透明电极(transparent
图片尺寸640x480![the reason why dpc ceramic and silicon nitride ceramic substrate](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=3340424377,637733737&fm=253&fmt=auto&app=138&f=JPG?w=592&h=481)
the reason why dpc ceramic and silicon nitride ceramic substrate
图片尺寸592x481![25d和3d集成有何不同看完这篇你就懂了](https://i.ecywang.com/upload/1/img1.baidu.com/it/u=3644264323,3079886620&fm=253&fmt=auto&app=138&f=JPEG?w=914&h=344)
25d和3d集成有何不同看完这篇你就懂了
图片尺寸964x363![1,2,3四个等级,涉及上述六个层次,封装基板(pkg基板或substrate)技术](https://i.ecywang.com/upload/1/img0.baidu.com/it/u=165889136,1095701836&fm=253&fmt=auto&app=120&f=JPEG?w=554&h=288)
1,2,3四个等级,涉及上述六个层次,封装基板(pkg基板或substrate)技术
图片尺寸554x288![on the use of certain hazardous substrates)已於2007年7月1日实施](https://i.ecywang.com/upload/1/img0.baidu.com/it/u=1482188030,2150922493&fm=253&fmt=auto&app=138&f=JPEG?w=600&h=371)
on the use of certain hazardous substrates)已於2007年7月1日实施
图片尺寸600x371![以台积电cowos(chip-on-wafer-on-substrate)的2.](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=3399968232,2233865241&fm=253&fmt=auto&app=138&f=PNG?w=1025&h=427)
以台积电cowos(chip-on-wafer-on-substrate)的2.
图片尺寸1080x450![pcba product parameters name: ultra thin cob aluminum substrate](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=4233992663,3999556252&fm=253&fmt=auto&app=138&f=JPEG?w=555&h=500)
pcba product parameters name: ultra thin cob aluminum substrate
图片尺寸786x708![ic封装基板_深圳博锐电路科技有限公司](https://i.ecywang.com/upload/1/img0.baidu.com/it/u=2520845443,1258355386&fm=253&fmt=auto&app=138&f=JPEG?w=439&h=242)
ic封装基板_深圳博锐电路科技有限公司
图片尺寸439x242![clcc assembly flow clcc 组 装流程 ceramic substrate 陶瓷基板](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=1748433916,1263246061&fm=253&fmt=auto&app=138&f=JPEG?w=667&h=500)
clcc assembly flow clcc 组 装流程 ceramic substrate 陶瓷基板
图片尺寸1080x810![95 96 electronic al2o3 ceramic alumina pcb substrate](https://i.ecywang.com/upload/1/img0.baidu.com/it/u=2633398578,1013329946&fm=253&fmt=auto&app=138&f=JPEG?w=480&h=480)
95 96 electronic al2o3 ceramic alumina pcb substrate
图片尺寸480x480![双层或双面印刷电路板的基板材料带有一层薄薄的导电金属,如铜,应用于](https://i.ecywang.com/upload/1/img2.baidu.com/it/u=3434032292,2838004877&fm=253&fmt=auto&app=138&f=JPEG?w=500&h=285)
双层或双面印刷电路板的基板材料带有一层薄薄的导电金属,如铜,应用于
图片尺寸600x342![科普ic封装基板](https://i.ecywang.com/upload/1/img1.baidu.com/it/u=2640244276,873808700&fm=253&fmt=auto&app=120&f=JPEG?w=725&h=500)
科普ic封装基板
图片尺寸1080x745![金属化陶瓷基板蚀刻电路 - buy metallized ceramic substrate,dbc](https://i.ecywang.com/upload/1/img1.baidu.com/it/u=846513673,1163107166&fm=253&fmt=auto&app=138&f=JPEG?w=503&h=500)
金属化陶瓷基板蚀刻电路 - buy metallized ceramic substrate,dbc
图片尺寸1536x1526![玻璃基板(glass substrate) 2.黑色矩阵(black matrix) 3.](https://i.ecywang.com/upload/1/img0.baidu.com/it/u=2327174425,3433819290&fm=253&fmt=auto&app=138&f=JPEG?w=667&h=500)
玻璃基板(glass substrate) 2.黑色矩阵(black matrix) 3.
图片尺寸1080x810![substrate上的互连线路制作下一步,我们还需要制作封装基板substrate](https://i.ecywang.com/upload/1/img1.baidu.com/it/u=3000143497,2214788696&fm=253&fmt=auto&app=120&f=JPEG?w=500&h=515)
substrate上的互连线路制作下一步,我们还需要制作封装基板substrate
图片尺寸1080x1113